Invention Grant
- Patent Title: Heat plate with clip
- Patent Title (中): 加热板夹
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Application No.: US12923874Application Date: 2010-10-13
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Publication No.: US08550148B2Publication Date: 2013-10-08
- Inventor: Yu-Po Huang , Tung-Jung Kuo
- Applicant: Yu-Po Huang , Tung-Jung Kuo
- Applicant Address: CN Kunshan, Jiangsu
- Assignee: Kunshan Jue-Choung Electronics Co., Ltd.
- Current Assignee: Kunshan Jue-Choung Electronics Co., Ltd.
- Current Assignee Address: CN Kunshan, Jiangsu
- Agency: HDLS IPR Services
- Agent Chun-Ming Shih
- Main IPC: F28F9/00
- IPC: F28F9/00 ; F28D15/00

Abstract:
A structure of heat plate with clip includes a heat plate and at least one clip. The heat plate is a hollow body having an interior cavity containing a capillary structure and a working fluid. The heat plate has a surface forming a receiving chamber. The clip is a resilient plate having mounting sections, which are mounted to the heat plate. The mounting sections have a portion received in the receiving chamber. In this way, replacement of inside-cavity supporting structure can be realized and advantages of thinned structure, flexible adjustment of positioning, and being hard to cause stress induced deformation can be achieved.
Public/Granted literature
- US20120090824A1 Heat plate with clip Public/Granted day:2012-04-19
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