Invention Grant
US08550254B2 Liquid ejecting head and liquid ejecting apparatus having resin wrapped filter
有权
具有树脂包覆过滤器的液体喷射头和液体喷射装置
- Patent Title: Liquid ejecting head and liquid ejecting apparatus having resin wrapped filter
- Patent Title (中): 具有树脂包覆过滤器的液体喷射头和液体喷射装置
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Application No.: US12861070Application Date: 2010-08-23
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Publication No.: US08550254B2Publication Date: 2013-10-08
- Inventor: Hiroyuki Kobayashi
- Applicant: Hiroyuki Kobayashi
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2009-195984 20090826
- Main IPC: B01D35/02
- IPC: B01D35/02 ; B41J2/175 ; B41J2/19

Abstract:
A liquid ejecting head includes a head body that has a nozzle opening for ejecting liquid supplied via a liquid supply path. A first supply member for the liquid supply path has an introduction port for introducing the liquid. A second supply member is positioned on a downstream side of the first supply member. A filter between the first and second supply members crosses the liquid supply path. An integrated molding portion fixes the first and second supply members by resin in a state where the filter is pinched between the first and second supply members. The first and second supply members have pinching portions for pinching the filter therebetween. A wall surface is positioned on one of the first and second supply members and between the filter and the resin to surround an outer periphery of the filter.
Public/Granted literature
- US20110050821A1 LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS Public/Granted day:2011-03-03
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