Invention Grant
- Patent Title: Buffer mechanism
- Patent Title (中): 缓冲机制
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Application No.: US13113077Application Date: 2011-05-23
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Publication No.: US08550440B2Publication Date: 2013-10-08
- Inventor: Dong-Wei Gao
- Applicant: Dong-Wei Gao
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis & Wispro Law Group, Inc.
- Priority: CN201010278426 20100910
- Main IPC: F16F13/02
- IPC: F16F13/02

Abstract:
A mechanism to act as a buffer, the mechanism includes a base seat defining a chamber and a bottom hole communicating with the chamber; a connecting shaft received in the chamber and extending through the bottom hole, the connecting shaft including a blocking portion for preventing detachment from the base seat, the connecting shaft axially defining a receiving hole and a plurality of mounting holes communicating with the receiving hole; a guiding rod fixed to the base seat, one end of the guiding rod extending out of the base seat and an inserting portion at the other end, the inserting portion including an abutting surface tapered toward the distal end; a buffer sleeved on the connecting shaft; a plurality of rolling bodies in the mounting holes and providing resistance between the abutting surface and the buffer; and a resilient member between the guiding rod and the blocking portion.
Public/Granted literature
- US20120061891A1 BUFFER MECHANISM Public/Granted day:2012-03-15
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