A pick-up device includes an sucking member, a blocking member, a grasping assembly, a restricting member and a covering member. The sucking member is adapted to utilize a vacuum to adhere to the surface of an electronic component and defines a through hole. The blocking member is secured to the sucking member and includes a blocking block. The finger-grasping assembly is slidably mounted to blocking member. The restricting member is movably mounted to the grasping assembly and movable relative to the sucking member. The restricting member includes two restricting portions. The covering member is secured to the restricting member by a first resilient member. The grasping assembly is operable to bias the restricting member and the covering member to move relative to the sucking member, the two restricting portions are engaged with the blocking block, and the covering member seals the through hole.