Invention Grant
- Patent Title: Iodate-containing chemical-mechanical polishing compositions and methods
- Patent Title (中): 含碘酸的化学机械抛光组合物和方法
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Application No.: US11387558Application Date: 2006-03-23
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Publication No.: US08551202B2Publication Date: 2013-10-08
- Inventor: Shoutian Li , Phillip W. Carter , Jian Zhang
- Applicant: Shoutian Li , Phillip W. Carter , Jian Zhang
- Applicant Address: US IL Aurora
- Assignee: Cabot Microelectronics Corporation
- Current Assignee: Cabot Microelectronics Corporation
- Current Assignee Address: US IL Aurora
- Agent Thomas E Omholt; Susan L Steele; Steven D Weseman
- Main IPC: C09G1/02
- IPC: C09G1/02 ; C09G1/04
Abstract:
The invention provides compositions and methods for planarizing or polishing a substrate. The composition comprises an abrasive, iodate ion, a nitrogen-containing compound selected from the group consisting of a nitrogen-containing C4-20 heterocycle and a C1-20 alkylamine, and a liquid carrier comprising water.
Public/Granted literature
- US20070224919A1 Iodate-containing chemical-mechanical polishing compositions and methods Public/Granted day:2007-09-27
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