Invention Grant
- Patent Title: Multilayer film and packaging material
- Patent Title (中): 多层膜和包装体
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Application No.: US13696604Application Date: 2011-05-30
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Publication No.: US08551590B2Publication Date: 2013-10-08
- Inventor: Yohei Nakashima , Shinichi Maesowa
- Applicant: Yohei Nakashima , Shinichi Maesowa
- Applicant Address: JP Tokyo
- Assignee: Sumitomo Bakelite Co., Ltd
- Current Assignee: Sumitomo Bakelite Co., Ltd
- Current Assignee Address: JP Tokyo
- Agency: Turocy & Watson, LLP
- Priority: JP2010-123828 20100531; JP2010-230081 20101012
- International Application: PCT/JP2011/002994 WO 20110530
- International Announcement: WO2011/152015 WO 20111208
- Main IPC: B29D22/00
- IPC: B29D22/00

Abstract:
An object of the present invention is to provide a multilayer film and a package body of which the thickness can be reduced than that of a conventional multilayer film, by having a good impact resistance, flex resistance, and anti-pinhole property. A multilayer film 100 according to the present invention includes a repeatedly laminated part 130. The repeatedly laminated part 130 is formed by alternately and repeatedly laminating a first layer 131 and a second layer 132. The first layer 131 consists mainly of a polyamide resin (excluding elastomers). The second layer 132 consists mainly of a copolymer of an olefin-based hydrocarbon having carbon number of 2 to 4 and a vinyl group-containing monomer.
Public/Granted literature
- US20130065002A1 MULTILAYER FILM AND PACKAGING MATERIAL Public/Granted day:2013-03-14
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