Invention Grant
US08551800B2 Methods of forming semiconductor structures including a movable switching element 有权
形成包括可移动开关元件的半导体结构的方法

Methods of forming semiconductor structures including a movable switching element
Abstract:
Semiconductor structures including a movable switching element having a base disposed on a conductive pad, a body extending from the base, and an end laterally adjacent and spaced apart from a conductive contact are disclosed. Upon application of a threshold voltage, the movable switching element may deform toward the conductive contact via an electrical field, establishing electrical contact between the conductive pad and the conductive contact. Various methods may be used to form such semiconductor structures, and switching devices including such semiconductor structures. Memory devices and electronic systems include such switching devices.
Information query
Patent Agency Ranking
0/0