A method of manufacturing an electronic device includes the steps of: forming a sacrifice layer made of at least one of an alkali metal oxide and an alkali earth metal oxide in a part of a first substrate; forming a supporting layer covering the sacrifice layer; forming an electronic device on the sacrifice layer with the supporting layer in between; exposing at least a part of a side face of the sacrifice layer by removing a part of the supporting layer; forming a support body between the electronic device and the supporting layer, and a surface of the first substrate; removing the sacrifice layer; breaking the support body and transferring the electronic device onto a second substrate by bringing the electronic device into close contact with an adhesion layer provided on a surface of the second substrate; removing a fragment of the support body belonging to the electronic device; removing at least an exposed region in the adhesion layer not covered with the electronic device; and forming a fixing layer on a surface of the electronic device and the surface of the second substrate.