Invention Grant
US08551928B2 Multi-agent type cleaning kit for semiconductor substrates, cleaning method using the same and method of producing semiconductor element
有权
用于半导体衬底的多剂型清洁套件，使用其的清洁方法和制造半导体元件的方法
- Patent Title: Multi-agent type cleaning kit for semiconductor substrates, cleaning method using the same and method of producing semiconductor element
- Patent Title (中): 用于半导体衬底的多剂型清洁套件，使用其的清洁方法和制造半导体元件的方法
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Application No.: US13281885Application Date: 2011-10-26
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Publication No.: US08551928B2Publication Date: 2013-10-08
- Inventor: Tetsuya Kamimura
- Applicant: Tetsuya Kamimura
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-241082 20101027
- Main IPC: C11D3/10
- IPC: C11D3/10 ; C11D3/00
Abstract:
A multi-agent type cleaning kit for applying to semiconductor substrates, which contains a foaming agent having an alkylene carbonate and a carbonic acid salt, a foaming aid having an acidic compound, and an oxidizing agent; at least the foaming agent is mixed with the foaming aid upon using for the cleaning of a semiconductor substrate, in combination with the oxidizing agent.
Public/Granted literature
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