Invention Grant
US08552082B2 Alkali-soluble polymer compound and photosensitive resin composition using the same
有权
碱溶性高分子化合物和使用其的感光性树脂组合物
- Patent Title: Alkali-soluble polymer compound and photosensitive resin composition using the same
- Patent Title (中): 碱溶性高分子化合物和使用其的感光性树脂组合物
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Application No.: US13096522Application Date: 2011-04-28
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Publication No.: US08552082B2Publication Date: 2013-10-08
- Inventor: Keon Woo Lee , Sang Kyu Kwak , Chang Soon Lee , Hye Hyeon Kim
- Applicant: Keon Woo Lee , Sang Kyu Kwak , Chang Soon Lee , Hye Hyeon Kim
- Applicant Address: KR Seoul
- Assignee: LG Chem, Ltd.
- Current Assignee: LG Chem, Ltd.
- Current Assignee Address: KR Seoul
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: KR10-2010-0039662 20100428
- Main IPC: C08F2/50
- IPC: C08F2/50 ; H05B6/68 ; B29C71/04

Abstract:
A novel alkali-soluble polymer compound including a dehydrogenated pimaric acid and/or its isomer as a repeating unit, and a photosensitive resin composition including the alkali-soluble polymer compound as an effective binder matrix are provided. A photosensitive resin composition using the alkali-soluble polymer compound including a dehydrogenated resin acid has excellent photosensitivity and developing characteristics cause a less deformation in a firing process, has excellent elasticity. Thus, the photosensitive resin composition is advantageous for curing various transparent photosensitive materials, in particular, materials of column spacers, an overcoat, a passivation layer, or the like, used for fabricating color filters of an LCD.
Public/Granted literature
- US20110269867A1 ALKALI-SOLUBLE POLYMER COMPOUND AND PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME Public/Granted day:2011-11-03
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