Invention Grant
- Patent Title: Composite maillard-resole binders
- Patent Title (中): 复合玉米 - 甲霜灵粘合剂
-
Application No.: US12595753Application Date: 2008-04-09
-
Publication No.: US08552140B2Publication Date: 2013-10-08
- Inventor: Brian Lee Swift
- Applicant: Brian Lee Swift
- Applicant Address: US IN Shelbyville
- Assignee: Knauf Insulation GmbH
- Current Assignee: Knauf Insulation GmbH
- Current Assignee Address: US IN Shelbyville
- Agency: Barnes & Thornburg LLP
- International Application: PCT/US2008/059730 WO 20080409
- International Announcement: WO2008/127936 WO 20081023
- Main IPC: C08G14/06
- IPC: C08G14/06
Abstract:
Composite Maillard-resole binders to produce or promote cohesion in non-assembled or loosely assembled matter.
Public/Granted literature
- US20110190425A1 COMPOSITE MAILLARD-RESOLE BINDERS Public/Granted day:2011-08-04
Information query
