Invention Grant
- Patent Title: Epoxy compound and method for manufacturing the same
- Patent Title (中): 环氧化合物及其制造方法
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Application No.: US13677727Application Date: 2012-11-15
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Publication No.: US08552188B2Publication Date: 2013-10-08
- Inventor: Hidetsugu Tsubouchi , Yoshikazu Haraguchi , Satoshi Hayakawa , Naoto Utsumi , Shinichi Taira , Yoshihisa Tanada , Nobuhisa Fujita , Koichi Shinhama , Kimiyoshi Annaka , Takuya Furuta
- Applicant: Otsuka Pharmaceutical Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Otsuka Pharmaceutical Co., Ltd.
- Current Assignee: Otsuka Pharmaceutical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2007-123097 20070508
- Main IPC: C07D405/12
- IPC: C07D405/12

Abstract:
The present invention provides a novel intermediate for manufacturing a 2,3-dihydroimidazo[2,1-b]oxazole compound with a high yield and a high purity, and a manufacturing method of the intermediate. The present invention provides an epoxy compound represented by the general formula (2): wherein, R1 represents a hydrogen or a lower alkyl group; and R2 represents a piperidyl group represented by the general formula (A1): (wherein, R3 represents a phenoxy group having a halogen-substituted lower alkoxy group substituted on a phenyl group, and the like) and the like; and n represents an integer of 1 to 6, a manufacturing method of the epoxy compound, and a manufacturing method of an oxazole compound using the epoxy method.
Public/Granted literature
- US20130072683A1 EPOXY COMPOUND AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2013-03-21
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