Invention Grant
- Patent Title: Thermoelectric application for waste heat recovery from semiconductor devices in power electronics systems
- Patent Title (中): 用于电力电子系统半导体器件废热回收的热电应用
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Application No.: US12685380Application Date: 2010-01-11
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Publication No.: US08552283B2Publication Date: 2013-10-08
- Inventor: Ercan Mehmet Dede , Brian Joseph Robert
- Applicant: Ercan Mehmet Dede , Brian Joseph Robert
- Applicant Address: US KY Erlanger
- Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
- Current Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
- Current Assignee Address: US KY Erlanger
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01L35/30
- IPC: H01L35/30 ; H01L35/34 ; H01L35/28 ; H01L35/02 ; H01L23/34 ; H01L23/38 ; H01L23/427
Abstract:
In a power electronics system of a next generation vehicle, a power module is provided including a thermoelectric device which is provided in a thermally conductive path between a power device and a cooling plate such that the thermoelectric device creates useful electric power from the waste heat of the power device.
Public/Granted literature
Information query
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