Invention Grant
- Patent Title: Cable for high speed data communications
- Patent Title (中): 电缆用于高速数据通信
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Application No.: US12786673Application Date: 2010-05-25
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Publication No.: US08552291B2Publication Date: 2013-10-08
- Inventor: Anil B. Lingambudi , Bhyrav M. Mutnury , Nam H. Pham , Saravanan Sethuraman
- Applicant: Anil B. Lingambudi , Bhyrav M. Mutnury , Nam H. Pham , Saravanan Sethuraman
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Biggers & Ohanian, LLP
- Agent H. Barrett Spraggins; Cynthia G. Seal
- Main IPC: H01B11/02
- IPC: H01B11/02

Abstract:
A cable for high speed data communications that includes a first inner conductor enclosed by a first dielectric layer and a second inner conductor enclosed by a second dielectric layer. The inner conductors and the dielectric layers are disposed within the cable in parallel with a longitudinal axis of the cable. The cable also includes drain conductors disposed within the cable laterally to the inner conductors adjacent to the dielectric layers along the longitudinal axis of the cable and within thirty degrees of a horizontal axis through the inner conductors. The cable also includes a conductive shield composed of a strip of conductive shield material wrapped in a rotational direction along and about the longitudinal axis around the inner conductors, the dielectric layers, and the drain conductors.
Public/Granted literature
- US20110290524A1 Cable For High Speed Data Communications Public/Granted day:2011-12-01
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