Invention Grant
US08552301B2 Contact equipment and circuit package 有权
联系设备和电路封装

  • Patent Title: Contact equipment and circuit package
  • Patent Title (中): 联系设备和电路封装
  • Application No.: US12960210
    Application Date: 2010-12-03
  • Publication No.: US08552301B2
    Publication Date: 2013-10-08
  • Inventor: Takashi Kusaka
  • Applicant: Takashi Kusaka
  • Applicant Address: JP Tokyo
  • Assignee: Advantest Corporation
  • Current Assignee: Advantest Corporation
  • Current Assignee Address: JP Tokyo
  • Priority: JP2010-005335 20100113
  • Main IPC: H05K1/03
  • IPC: H05K1/03
Contact equipment and circuit package
Abstract:
A contact device including a contact array, in which contacts are arranged in a grid, and a plurality of differential wire pairs electrically connected to the contact array, wherein each differential wire pair is connected to a contact pair formed by two adjacent contacts in the contact array, and each contact pair is arranged such that a direction of a straight line connecting the two contacts therein is different from a direction of a straight line connecting the two contacts in a contact pair adjacent thereto.
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