Invention Grant
- Patent Title: Contact equipment and circuit package
- Patent Title (中): 联系设备和电路封装
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Application No.: US12960210Application Date: 2010-12-03
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Publication No.: US08552301B2Publication Date: 2013-10-08
- Inventor: Takashi Kusaka
- Applicant: Takashi Kusaka
- Applicant Address: JP Tokyo
- Assignee: Advantest Corporation
- Current Assignee: Advantest Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2010-005335 20100113
- Main IPC: H05K1/03
- IPC: H05K1/03

Abstract:
A contact device including a contact array, in which contacts are arranged in a grid, and a plurality of differential wire pairs electrically connected to the contact array, wherein each differential wire pair is connected to a contact pair formed by two adjacent contacts in the contact array, and each contact pair is arranged such that a direction of a straight line connecting the two contacts therein is different from a direction of a straight line connecting the two contacts in a contact pair adjacent thereto.
Public/Granted literature
- US20110168433A1 CONTACT EQUIPMENT AND CIRCUIT PACKAGE Public/Granted day:2011-07-14
Information query