Invention Grant
- Patent Title: Mounting structure
- Patent Title (中): 安装结构
-
Application No.: US13110136Application Date: 2011-05-18
-
Publication No.: US08552307B2Publication Date: 2013-10-08
- Inventor: Kiyohiro Hine , Shigeaki Sakatani , Akio Furusawa
- Applicant: Kiyohiro Hine , Shigeaki Sakatani , Akio Furusawa
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: RatnerPrestia
- Priority: JP2010-116353 20100520
- Main IPC: H05K1/18
- IPC: H05K1/18
Abstract:
A mounting structure includes an insulating substrate having a substrate electrode on which at least one electrode notch is provided and a resist, an electronic component having an electronic component electrode to be electrically connected to the substrate electrode, and solder paste printed on a surface of the substrate electrode. The substrate electrode has a following relation, 0
Public/Granted literature
- US20110284278A1 MOUNTING STRUCTURE Public/Granted day:2011-11-24
Information query
