Invention Grant
- Patent Title: Electrical feedthrough assembly
- Patent Title (中): 电气馈通组件
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Application No.: US12836831Application Date: 2010-07-15
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Publication No.: US08552311B2Publication Date: 2013-10-08
- Inventor: Kurt J. Koester , Timothy Beerling
- Applicant: Kurt J. Koester , Timothy Beerling
- Applicant Address: US CA Valencia
- Assignee: Advanced Bionics
- Current Assignee: Advanced Bionics
- Current Assignee Address: US CA Valencia
- Agency: Van Cott, Bagley, Cornwall & McCarthy P.C.
- Agent Steven L. Nichols
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K13/00
Abstract:
An electrical feedthrough includes a ceramic body and a ribbon via extending through the ceramic body, an interface between the ribbon via and the ceramic body being sealed using partial transient liquid phase bonding. The ribbon via extends out of the ceramic body and makes an electrical connection with an external device.
Public/Granted literature
- US20120012374A1 ELECTRICAL FEEDTHROUGH ASSEMBLY Public/Granted day:2012-01-19
Information query
