Invention Grant
- Patent Title: Ion implantation method and ion implantation apparatus
- Patent Title (中): 离子注入法和离子注入装置
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Application No.: US13053624Application Date: 2011-03-22
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Publication No.: US08552404B2Publication Date: 2013-10-08
- Inventor: Hirofumi Asai , Yoshikazu Hashino
- Applicant: Hirofumi Asai , Yoshikazu Hashino
- Applicant Address: JP Kyoto
- Assignee: Nissin Ion Equipment Co., Ltd
- Current Assignee: Nissin Ion Equipment Co., Ltd
- Current Assignee Address: JP Kyoto
- Agency: Procopio, Cory, Hargreaves & Savitch LLP
- Priority: JP2011-020362 20110202
- Main IPC: G21K5/10
- IPC: G21K5/10

Abstract:
In an ion implantation method, ion implantation into a substrate is performed while changing a relative positional relation between an ion beam and the substrate. A first ion implantation process in which a uniform dose amount distribution is formed within the substrate and a second ion implantation process in which a non-uniform dose amount distribution is formed within the substrate are performed in a predetermined order. Moreover, a cross-sectional size of an ion beam irradiated on the substrate during the second ion implantation process is set smaller than a cross-sectional size of an ion beam irradiated on the substrate during the first ion implantation process.
Public/Granted literature
- US20120196428A1 ION IMPLANTATION METHOD AND ION IMPLANTATION APPARATUS Public/Granted day:2012-08-02
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