Invention Grant
- Patent Title: Ion milling device
- Patent Title (中): 离子铣削装置
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Application No.: US13386980Application Date: 2010-07-14
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Publication No.: US08552407B2Publication Date: 2013-10-08
- Inventor: Asako Kaneko , Hirobumi Muto , Atsushi Kamino
- Applicant: Asako Kaneko , Hirobumi Muto , Atsushi Kamino
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Mattingly & Malur, PC
- Priority: JP2009-177184 20090730
- International Application: PCT/JP2010/004555 WO 20100714
- International Announcement: WO2011/013311 WO 20110203
- Main IPC: G01N1/32
- IPC: G01N1/32

Abstract:
Disclosed is a shield (8, 10) disposed between an ion source (1) of an ion milling device and a sample (7) so as to be in contact with the sample. The shield is characterized by having a circular shape having an opening at the center, and by being capable of rotating about an axis (11) extending through the opening. Further, a groove is provided in the ion source-side surface of an end portion of the shield, and an inclined surface is provided on an end portion of the shield. Thus, an ion milling device having a shield, wherein the maximum number of machining operations can be increased, and the position of the shield can be accurately adjusted.
Public/Granted literature
- US20120126146A1 ION MILLING DEVICE Public/Granted day:2012-05-24
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