Invention Grant
- Patent Title: Package for a light emitting element
- Patent Title (中): 用于发光元件的封装
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Application No.: US13227703Application Date: 2011-09-08
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Publication No.: US08552460B2Publication Date: 2013-10-08
- Inventor: Thomas Murphy , Andreas Hase , Matthias Heschel
- Applicant: Thomas Murphy , Andreas Hase , Matthias Heschel
- Applicant Address: TW Hsinchu
- Assignee: TSMC Solid State Lighting Ltd.
- Current Assignee: TSMC Solid State Lighting Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
A high-brightness LED module includes a substrate with a recess in which a light emitting element is mounted. The recess is defined by a sidewalls and a relatively thin membrane. At least two micro-vias are provided in the membrane and include conductive material that passes through the membrane. A p-contact of the light emitting element is coupled to a first micro-via and an n-contact of the light emitting element is coupled to a second micro-via.
Public/Granted literature
- US20110316015A1 PACKAGE FOR A LIGHT EMITTING ELEMENT Public/Granted day:2011-12-29
Information query
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