Invention Grant
- Patent Title: LED package and method for manufacturing the same
- Patent Title (中): LED封装及其制造方法
-
Application No.: US13326340Application Date: 2011-12-15
-
Publication No.: US08552462B2Publication Date: 2013-10-08
- Inventor: Hou-Te Lin , Ming-Ta Tsai
- Applicant: Hou-Te Lin , Ming-Ta Tsai
- Applicant Address: TW Hsinchu Hsien
- Assignee: Advanced Optoelectric Technology, Inc.
- Current Assignee: Advanced Optoelectric Technology, Inc.
- Current Assignee Address: TW Hsinchu Hsien
- Agency: Altis & Wispro Law Group, Inc.
- Priority: CN201110083148 20110402
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
An LED package includes an electrode, an LED chip, and an insulation layer. The electrode includes a first electrode and a second electrode. The first electrode and the second electrode are separate from each other. The LED chips are connected to the first and second electrodes. The insulation layer covers the first and second electrodes and the LED chip. A cavity is defined in the first electrode for receiving the LED chip therein. A channel is defined between the first electrode and the second electrode. The channel communicates with the cavity and the insulation layer fills in the cavity and the channel.
Public/Granted literature
- US20120248482A1 LED PACKAGE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2012-10-04
Information query
IPC分类: