Invention Grant
- Patent Title: Electronic devices with yielding substrates
-
Application No.: US13751563Application Date: 2013-01-28
-
Publication No.: US08552463B2Publication Date: 2013-10-08
- Inventor: Michael A. Tischler , Philippe M. Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
- Applicant: Michael A. Tischler , Philippe M. Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
- Applicant Address: CA Burnaby
- Assignee: Cooledge Lighting Inc.
- Current Assignee: Cooledge Lighting Inc.
- Current Assignee Address: CA Burnaby
- Agency: Bingham McCutchen LLP
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L21/00
Abstract:
In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
Public/Granted literature
- US20130181238A1 ELECTRONIC DEVICES WITH YIELDING SUBSTRATES Public/Granted day:2013-07-18
Information query
IPC分类:
