Invention Grant
- Patent Title: Power semiconductor device
- Patent Title (中): 功率半导体器件
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Application No.: US12724987Application Date: 2010-03-16
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Publication No.: US08552468B2Publication Date: 2013-10-08
- Inventor: Atsushi Narazaki
- Applicant: Atsushi Narazaki
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2009-135022 20090604
- Main IPC: H01L29/74
- IPC: H01L29/74

Abstract:
A semiconductor layer has a first layer of first conductive type, a second layer of second conductive type, and a third layer. The third layer has a first region of first conductive type, and a second region of second conductive type. A second electrode is in contact with each of the first and second regions. A trench is formed on the semiconductor layer at a surface opposite to its surface facing a first electrode. A gate electrode is embedded in the trench with a gate insulating film interposed therebetween. The gate electrode includes a first portion projecting into the first layer through the first region and the second layer, a second portion projecting into the first layer through the second region and the second layer. The second portion projects into the first layer deeper than a depth in which the first portion projects into the first layer.
Public/Granted literature
- US20100308401A1 POWER SEMICONDUCTOR DEVICE Public/Granted day:2010-12-09
Information query
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