Invention Grant
- Patent Title: Semiconductor apparatus having reverse blocking characteristics and method of manufacturing the same
- Patent Title (中): 具有反向阻挡特性的半导体装置及其制造方法
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Application No.: US13139789Application Date: 2009-12-11
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Publication No.: US08552471B2Publication Date: 2013-10-08
- Inventor: Yasuhiro Okamoto , Yuji Ando , Tatsuo Nakayama , Kazuki Ota , Takashi Inoue , Hironobu Miyamoto , Kazuomi Endo
- Applicant: Yasuhiro Okamoto , Yuji Ando , Tatsuo Nakayama , Kazuki Ota , Takashi Inoue , Hironobu Miyamoto , Kazuomi Endo
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2009-007395 20090116
- International Application: PCT/JP2009/006776 WO 20091211
- International Announcement: WO2010/082272 WO 20100722
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
There is provided a semiconductor apparatus capable of achieving both a reverse blocking characteristic and a low on-resistance. The semiconductor apparatus includes a first semiconductor layer including a channel layer, a source electrode formed on the first semiconductor layer, a drain electrode formed at a distance from the source electrode on the first semiconductor layer, and a gate electrode formed between the source electrode and the drain electrode on the first semiconductor layer. The drain electrode includes a first drain region where reverse current between the first semiconductor layer and the first drain region is blocked, and a second drain region formed at a greater distance from the gate electrode than the first drain region, where a resistance between the first semiconductor layer and the second drain region is lower than a resistance between the first semiconductor layer and the first drain region.
Public/Granted literature
- US20110260217A1 SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2011-10-27
Information query
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