Invention Grant
- Patent Title: Semiconductor devices semiconductor pillars and method of fabricating the same
- Patent Title (中): 半导体器件半导体柱及其制造方法
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Application No.: US12831577Application Date: 2010-07-07
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Publication No.: US08552491B2Publication Date: 2013-10-08
- Inventor: Yong-Hoon Son , Jong-Wook Lee , Jong-Hyuk Kang
- Applicant: Yong-Hoon Son , Jong-Wook Lee , Jong-Hyuk Kang
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec
- Priority: KR10-2009-73975 20090811
- Main IPC: H01L29/78
- IPC: H01L29/78

Abstract:
A semiconductor device includes a trench isolation region provided on a substrate and defining first and second active regions separated from each other. A first semiconductor pillar protruding upward from the first active region is provided. A second semiconductor pillar protruding upward from the second active region is provided. A first gate mask extending to cross over the first and second active regions is provided. The first gate mask surrounds upper sidewalls of the first and second semiconductor pillars. A first gate line formed below the first gate mask, separated from the first and second active regions, and surrounding parts of sidewalls of the first and second semiconductor pillars is provided.
Public/Granted literature
- US20110039381A1 Semiconductor Devices Semiconductor Pillars and Method of Fabricating the Same Public/Granted day:2011-02-17
Information query
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