Invention Grant
- Patent Title: Semiconductor device and method for forming the same
- Patent Title (中): 半导体装置及其形成方法
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Application No.: US13378253Application Date: 2011-03-02
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Publication No.: US08552504B2Publication Date: 2013-10-08
- Inventor: Zhijiong Luo , Haizhou Yin , Huilong Zhu
- Applicant: Zhijiong Luo , Haizhou Yin , Huilong Zhu
- Applicant Address: CN Beijing
- Assignee: Institute of Microelectronics, Chinese Academy of Sciences
- Current Assignee: Institute of Microelectronics, Chinese Academy of Sciences
- Current Assignee Address: CN Beijing
- Agency: Troutman Sanders LLP
- Priority: CN201010557270 20101122
- International Application: PCT/CN2011/071460 WO 20110302
- International Announcement: WO2012/068797 WO 20120531
- Main IPC: H01L21/70
- IPC: H01L21/70

Abstract:
The present invention provides a semiconductor device, which is formed on a semiconductor substrate, comprising a gate stack, a channel region, and source/drain regions, wherein the gate stack is on the channel region, the channel region is in the semiconductor substrate, the source/drain regions are embedded in the semiconductor substrate, and each of the source/drain regions comprises a sidewall and a bottom, a second semiconductor layer being sandwiched between the channel region and a portion of the sidewall distant from the bottom, a first semiconductor layer being sandwiched between the semiconductor substrate and at least a portion of the bottom distant from the sidewall, and an insulating layer being sandwiched between the semiconductor substrate and the other portions of the bottom and/or the other portions of the sidewall. The present invention also provides a method for forming the semiconductor device. The present invention helps preventing the dopants in the source/drain regions from diffusing into the substrate.
Public/Granted literature
- US20120261674A1 SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME Public/Granted day:2012-10-18
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