Invention Grant
US08552507B2 Semiconductor device and method of manufacturing the same 有权
半导体器件及其制造方法

Semiconductor device and method of manufacturing the same
Abstract:
A p-type MIS transistor Qp arranged in a pMIS region Rp of a silicon substrate 1 includes a pMIS gate electrode GEp formed so as to interpose a pMIS gate insulating film GIp formed of a first insulating film z1 and a first high-dielectric film hk1, and an n-type MIS transistor Qn arranged in an nMIS region Rn includes an nMIS gate electrode GEn formed so as to interpose an nMIS gate insulating film GIn formed of a first insulating film z1 and a second high-dielectric film hk2. The first high-dielectric film hk1 is formed of an insulating film mainly made of hafnium and oxygen with containing aluminum, titanium, or tantalum. Also, the second high-dielectric film hk2 is formed of an insulating film mainly made of hafnium, silicon, and oxygen with containing an element of any of group Ia, group IIa, and group IIIa.
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