Invention Grant
- Patent Title: Conductive compositions and processes for use in the manufacture of semiconductor devices
- Patent Title (中): 用于制造半导体器件的导电组合物和方法
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Application No.: US12254189Application Date: 2008-10-20
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Publication No.: US08552558B2Publication Date: 2013-10-08
- Inventor: Alan Frederick Carroll , Kenneth Warren Hang , Brian J. Laughlin , Yueli Wang
- Applicant: Alan Frederick Carroll , Kenneth Warren Hang , Brian J. Laughlin , Yueli Wang
- Applicant Address: US DE Wilmington
- Assignee: E I du Pont de Nemours and Company
- Current Assignee: E I du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Main IPC: H01L29/45
- IPC: H01L29/45 ; H01L31/0224
Abstract:
The present invention is directed to a thick film conductive composition comprising: (a) electrically conductive silver powder; (c) fluorine-containing glass frit; dispersed in (d) organic vehicle and devices made therefrom.
Public/Granted literature
- US20090101199A1 CONDUCTIVE COMPOSITIONS AND PROCESSES FOR USE IN THE MANUFACTURE OF SEMICONDUCTOR DEVICES Public/Granted day:2009-04-23
Information query
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