Invention Grant
- Patent Title: Laminated ceramic electronic component
- Patent Title (中): 层压陶瓷电子元件
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Application No.: US13603549Application Date: 2012-09-05
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Publication No.: US08552826B2Publication Date: 2013-10-08
- Inventor: Masanori Nakamura , Masahiro Otsuka , Shoichiro Suzuki , Koichi Banno , Taisuke Kanzaki , Akihiro Shiota
- Applicant: Masanori Nakamura , Masahiro Otsuka , Shoichiro Suzuki , Koichi Banno , Taisuke Kanzaki , Akihiro Shiota
- Applicant Address: JP Nagaokakyo-Shi, Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo-Shi, Kyoto-fu
- Agency: Dickstein Shapiro LLP
- Priority: JP2010-059505 20100316
- Main IPC: H01F27/02
- IPC: H01F27/02
Abstract:
A laminated ceramic electronic component having excellent mechanical characteristics and internal electrode corrosion resistance, high degree of freedom in ceramic material design, low cost, and low defective rate includes a laminate having a plurality of laminated ceramic layers and a plurality of Al/Cu alloy-containing internal electrodes at specific interfaces between ceramic layers; where the Al/Cu ratio of the Al/Cu alloy is 80/20 or more.
Public/Granted literature
- US20120326558A1 LAMINATED CERAMIC ELECTRONIC COMPONENT Public/Granted day:2012-12-27
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