Invention Grant
US08553058B2 Pressure adjusting mechanism for adjusting pressure of a thermal print head and thermal sublimation printer therewith 有权
用于调节热打印头和热升华打印机的压力的压力调节机构

  • Patent Title: Pressure adjusting mechanism for adjusting pressure of a thermal print head and thermal sublimation printer therewith
  • Patent Title (中): 用于调节热打印头和热升华打印机的压力的压力调节机构
  • Application No.: US13491611
    Application Date: 2012-06-08
  • Publication No.: US08553058B2
    Publication Date: 2013-10-08
  • Inventor: Chun-Chia Huang
  • Applicant: Chun-Chia Huang
  • Applicant Address: TW Xindian Dist., New Taipei
  • Assignee: HiTi Digital, Inc.
  • Current Assignee: HiTi Digital, Inc.
  • Current Assignee Address: TW Xindian Dist., New Taipei
  • Agent Winston Hsu; Scott Margo
  • Priority: TW101100857A 20120109
  • Main IPC: B41J2/335
  • IPC: B41J2/335 B41J25/304
Pressure adjusting mechanism for adjusting pressure of a thermal print head and thermal sublimation printer therewith
Abstract:
A pressure adjusting mechanism for adjusting pressure applied on a thermal print head includes a pressing plate, a plurality of resilient members and a pressure adjusting member. The pressing plate is disposed above the thermal print head and comprising a first pressed section and a second pressed section connected to the first pressed section. The plurality of resilient members is connected to the first pressed section of the pressing plate and the thermal print head and to the second pressed section of the pressing plate and the thermal print head, respectively. The pressure adjusting member is pivoted to the pressing plate for driving the pressing plate to move relative to the thermal print head, so as to press the plurality of resilient members for providing the thermal print head with pressure, such that the plurality of resilient members drives the pressing plate to equilibrate the pressing plate.
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