Invention Grant
- Patent Title: Electronic component, electronic device, and manufacturing method for the electronic component
- Patent Title (中): 电子部件,电子设备和电子部件的制造方法
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Application No.: US13184032Application Date: 2011-07-15
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Publication No.: US08553392B2Publication Date: 2013-10-08
- Inventor: Tsuneaki Tamachi , Ryo Sato , Isamu Shinoda , Shunji Watanabe
- Applicant: Tsuneaki Tamachi , Ryo Sato , Isamu Shinoda , Shunji Watanabe
- Applicant Address: JP Chiba-Shi, Chiba
- Assignee: Seiko Instruments Inc.
- Current Assignee: Seiko Instruments Inc.
- Current Assignee Address: JP Chiba-Shi, Chiba
- Agency: Brinks Hofer Gilson & Lione
- Priority: JP2010-167358 20100726; JP2011-116744 20110525
- Main IPC: H01G9/00
- IPC: H01G9/00 ; H01G2/10

Abstract:
Provided is an electric double-layer capacitor and the like, which may be easily manufactured. In a recessed container (2) constituting a package of an electric double-layer capacitor (1), a step portion (4) is formed. With this, the recessed container (2) has two parallel bottom surfaces which are not provided in the same plane, that is, a first bottom surface constituting a bottom portion of a recessed portion (13) and a second bottom surface constituting an upper surface of the step portion (4). The first bottom surface and the second bottom surface respectively have metallic layers (11, 9) formed thereon, which pass through the recessed container (2) toward an outside to respectively connect to terminals (12, 10). Electrodes (6, 5) are respectively connected to the upper surfaces of the metallic layers (11, 9).
Public/Granted literature
- US20120019983A1 ELECTRONIC COMPONENT, ELECTRONIC DEVICE, AND MANUFACTURING METHOD FOR THE ELECTRONIC COMPONENT Public/Granted day:2012-01-26
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