Invention Grant
- Patent Title: Electronic apparatus
- Patent Title (中): 电子仪器
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Application No.: US13137987Application Date: 2011-09-22
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Publication No.: US08553398B2Publication Date: 2013-10-08
- Inventor: Ikki Tatsukami
- Applicant: Ikki Tatsukami
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Staas & Halsey LLP
- Main IPC: H05K5/00
- IPC: H05K5/00 ; G06F1/16

Abstract:
An electronic apparatus including: a main circuit board through which a through hole is formed perpendicularly between a first face and a second face of the circuit board; a connector mounted on the first face; and a supporter including a supporting portion for supporting the connector on the first face, and a fixing portion having a screw hole overlapping the through hole on the second face. The supporter is fixed to the main circuit board by a screw inserted through the through hole from the first face and into the screw hole, while the connector is supported by the supporter.
Public/Granted literature
- US20120015530A1 Electronic apparatus Public/Granted day:2012-01-19
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