An electronic apparatus includes a heat dissipating module mounted at a position interposed between a shield plate and a main circuit board and air sent from a fan through a heat dissipating fin is discharged from an air vent, wherein the heat dissipating module includes the heat dissipating fin in contact with the heat generating electronic component; the fan sending the air; and a base body supporting the fan and the heat dissipating fin at a position closer to a side of the shield plate than a position of the fan, and having a slope between the fan and the heat dissipating fin for guiding the air sent from the fan to the heat dissipating fin, wherein the shield plate includes a cut and raised piece which faces the slope and obliquely guides the air sent from the fan to the heat dissipating fin along the slope.