Invention Grant
- Patent Title: Fan mounting apparatus for heat disspation
- Patent Title (中): 散热风扇安装装置
-
Application No.: US13328021Application Date: 2011-12-16
-
Publication No.: US08553413B2Publication Date: 2013-10-08
- Inventor: Yun-Lung Chen
- Applicant: Yun-Lung Chen
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis & Wispro Law Group, Inc.
- Priority: CN201110131652 20110520
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A fan mounting apparatus includes a case and a fan. The case includes a bottom plate and a rear plate substantially perpendicular to the bottom plate. A clipping member extends to an interior of the rear plate in a first direction. The fan includes a sidewall with a securing portion. An extending direction of the securing portion is substantially perpendicular to the first direction. The securing portion includes a protruding surface. The securing portion is engaged with the clipping member, and the protruding surface abuts the clipping member.
Public/Granted literature
- US20120292479A1 FAN MOUNTING APPARATUS FOR HEAT DISSPATION Public/Granted day:2012-11-22
Information query