Invention Grant
- Patent Title: Electronic device with heat dissipation module
- Patent Title (中): 带散热模块的电子设备
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Application No.: US13335967Application Date: 2011-12-23
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Publication No.: US08553415B2Publication Date: 2013-10-08
- Inventor: Zhen-Yu Wang , Chang-Shen Chang , Ben-Fan Xia
- Applicant: Zhen-Yu Wang , Chang-Shen Chang , Ben-Fan Xia
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20

Abstract:
An electronic device includes a casing, a fan, and a heat sink. The casing defines a plurality of through holes therein. The fan defines air outlet at one side thereof facing the through holes of the casing. The air outlet includes a first portion and a second portion. Air pressure in the first portion is larger than air pressure of the second portion. The heat sink includes a first fin set arranged on the first portion and a second fin set arranged on the second portion. A first passage is defined between each two neighboring first fins. A second passage is defined between each two neighboring second fins. A width of the second passage is less than that of the first passage.
Public/Granted literature
- US20130050941A1 ELECTRONIC DEVICE WITH HEAT DISSIPATION MODULE Public/Granted day:2013-02-28
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