Invention Grant
- Patent Title: Motherboard
- Patent Title (中): 母板
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Application No.: US13072831Application Date: 2011-03-28
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Publication No.: US08553427B2Publication Date: 2013-10-08
- Inventor: Meng-Zhou Liu , Wen-Wu Wu
- Applicant: Meng-Zhou Liu , Wen-Wu Wu
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis & Wispro Law Group, Inc.
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/14

Abstract:
A motherboard includes a first circuit board, a second circuit board, and wiring. The first circuit board includes at least a programmable chip, a programming interface, a first data interface, and at least one jumper corresponding to the programmable chip. The second circuit board includes a CPU (central processing unit), a RAM unit, and at least a second data interface corresponding to the programmable chip. The motherboard of the present disclosure concentrates programmable chips on the first circuit board, thereby providing a unified programming interface to enhance the convenience of programming multiple programmable chips.
Public/Granted literature
- US20120212921A1 MOTHERBOARD Public/Granted day:2012-08-23
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