Invention Grant
- Patent Title: Component for reducing mechanical stress on a PCB
- Patent Title (中): 用于减少PCB上的机械应力的组件
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Application No.: US12601623Application Date: 2007-05-24
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Publication No.: US08553428B2Publication Date: 2013-10-08
- Inventor: Lars Bolander , Tomas Bergsten
- Applicant: Lars Bolander , Tomas Bergsten
- Applicant Address: SE Stockholm
- Assignee: Telefonaktiebolaget L M Ericsson (publ)
- Current Assignee: Telefonaktiebolaget L M Ericsson (publ)
- Current Assignee Address: SE Stockholm
- International Application: PCT/SE2007/050356 WO 20070524
- International Announcement: WO2008/143565 WO 20081127
- Main IPC: H05K7/02
- IPC: H05K7/02 ; H05K7/04

Abstract:
A component for mounting on a PCB, intended to support an electronics component, with an extension in the longitudinal, lateral and vertical directions. The component has a first and a second main surface, the second main surface being intended for mounting on the PCB. The component is made in a non conducting material, with a first layer of conducting material arranged on its first main surface, the conducting layer being connected to a conducting layer on the second main surface of the component by electrically conducting means. The component's extension in the vertical direction is smaller than its extension in either the longitudinal or lateral direction.
Public/Granted literature
- US20100182759A1 Component For Reducing Mechanical Stress On A PCB Public/Granted day:2010-07-22
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