A miniature microphone is provided. In one embodiment, the miniature microphone comprises: a circuit board substrate at the upper part of the miniature microphone, wherein a plurality of contact pads are configured at prescribed positions on one side of the circuit board substrate and one or more electrical components are installed on the other side thereof; a protection frame with a cavity in the central portion thereoftherein, wherein one or more components are installed inside the cavity, the outer side of the protection frame forms the body portion, a first metal shielding layer is provided on the inner surface of the body portion, and an insulating mechanism is provided on the inner side of the first metal shielding layer, which enables the one or more components to be electrically insulated from the first metal shielding layer; and a bottom plate, wherein one or more sound holes are provided in the central portion thereoftherein for passing sound, and a second metal shielding layer is provided on the whole surface of the side of the bottom plate coming into contact with the protection frame.