Invention Grant
- Patent Title: Tightly-coupled near-field communication-link connector-replacement chips
- Patent Title (中): 紧耦合近场通信链路连接器替换芯片
-
Application No.: US12655041Application Date: 2009-12-21
-
Publication No.: US08554136B2Publication Date: 2013-10-08
- Inventor: Gary D. McCormack
- Applicant: Gary D. McCormack
- Applicant Address: US CA Mountain View
- Assignee: WaveConnex, Inc.
- Current Assignee: WaveConnex, Inc.
- Current Assignee Address: US CA Mountain View
- Agency: Kolisch Hartwell, P.C.
- Main IPC: H04B5/00
- IPC: H04B5/00

Abstract:
Tightly-coupled near-field transmitter/receiver pairs are deployed such that the transmitter is disposed at a terminal portion of a first conduction path, the receiver is disposed at a terminal portion of a second conduction path, the transmitter and receiver are disposed in close proximity to each other, and the first conduction path and the second conduction path are discontiguous with respect to each other. In some embodiments of the present invention, close proximity refers to the transmitter antenna and the receiver antenna being spaced apart by a distance such that, at wavelengths of the transmitter carrier frequency, near-field coupling is obtained. In some embodiments, the transmitter and receiver are disposed on separate substrates that are moveable relative to each other. In alternative embodiments, the transmitter and receiver are disposed on the same substrate.
Public/Granted literature
- US20100159829A1 Tightly-coupled near-field communication-link connector-replacement chips Public/Granted day:2010-06-24
Information query