Invention Grant
US08554340B2 Implantable electrode array assembly including a carrier, superstrates mounted to the carrier and electrodes disposed on the superstrates
有权
可植入电极阵列组件，其包括载体，安装到载体的覆层和设置在覆层上的电极
- Patent Title: Implantable electrode array assembly including a carrier, superstrates mounted to the carrier and electrodes disposed on the superstrates
- Patent Title (中): 可植入电极阵列组件，其包括载体，安装到载体的覆层和设置在覆层上的电极
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Application No.: US13364973Application Date: 2012-02-02
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Publication No.: US08554340B2Publication Date: 2013-10-08
- Inventor: John Janik , Rob Brindley , Edward Chia-Ning Tang , James Bernard Dunlop, Jr. , Leland Joseph Spangler
- Applicant: John Janik , Rob Brindley , Edward Chia-Ning Tang , James Bernard Dunlop, Jr. , Leland Joseph Spangler
- Applicant Address: US MI Kalamazoo
- Assignee: Stryker Corporation
- Current Assignee: Stryker Corporation
- Current Assignee Address: US MI Kalamazoo
- Main IPC: A61N1/00
- IPC: A61N1/00
Abstract:
An implantable electrode array (40, 310) that includes multiple spaced apart electrodes (42, 316) to which current can be individually sourced and sunk. The array includes a carrier (80, 312) that supports the electrodes. One or more control modules that source current to or sink current from the electrodes are disposed in windows (81, 404) within the carrier.
Public/Granted literature
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