Invention Grant
US08554349B2 High-frequency interpolation device and high-frequency interpolation method 有权
高频插补装置和高频插补方法

  • Patent Title: High-frequency interpolation device and high-frequency interpolation method
  • Patent Title (中): 高频插补装置和高频插补方法
  • Application No.: US12680899
    Application Date: 2008-10-22
  • Publication No.: US08554349B2
    Publication Date: 2013-10-08
  • Inventor: Takeshi Hashimoto
  • Applicant: Takeshi Hashimoto
  • Applicant Address: JP Tokyo
  • Assignee: Clarion Co., Ltd.
  • Current Assignee: Clarion Co., Ltd.
  • Current Assignee Address: JP Tokyo
  • Agency: Ditthavong Mori & Steiner, P.C.
  • Priority: JP2007-274606 20071023
  • International Application: PCT/JP2008/069089 WO 20081022
  • International Announcement: WO2009/054393 WO 20090430
  • Main IPC: G06F17/00
  • IPC: G06F17/00 H03G5/00
High-frequency interpolation device and high-frequency interpolation method
Abstract:
It is possible to generate an interpolation signal in which spectrum in frequency characteristics develops in a continuous manner according to a reproduced music without increasing the sampling rate (sampling frequency) in up-sampling processing. A high-frequency interpolation device 1 includes: a frequency band determination section 2 that determines a bandwidth type of an audio signal as a frequency band determination value preset for each bandwidth according to the frequency characteristics of the audio signal; and an interpolation signal generation section 3 that selects a filter coefficient of a high-pass filter in accordance with the frequency band determination value 2, performs filtering for the audio signal by using the high-pass filter having the selected filter coefficient, and generates a high-frequency interpolation signal for the audio signal.
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