Invention Grant
- Patent Title: System and method for cutting substrate into workpieces
- Patent Title (中): 将基材切割成工件的系统和方法
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Application No.: US12914971Application Date: 2010-10-28
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Publication No.: US08554355B2Publication Date: 2013-10-08
- Inventor: Xiao-Bin Wu
- Applicant: Xiao-Bin Wu
- Applicant Address: CN Huaian TW Tayuan, Taoyuan
- Assignee: Hong Heng Sheng Electronical Technology (HuaiAn) Co., Ltd,Zhen Ding Technology Co., Ltd.
- Current Assignee: Hong Heng Sheng Electronical Technology (HuaiAn) Co., Ltd,Zhen Ding Technology Co., Ltd.
- Current Assignee Address: CN Huaian TW Tayuan, Taoyuan
- Agency: Altis & Wispro Law Group, Inc.
- Priority: CN201010130088 20100322
- Main IPC: G06F19/00
- IPC: G06F19/00 ; H01L21/00 ; H01L21/30 ; B26D7/08 ; B26D7/06

Abstract:
A computer obtains user input from an input to control a cutter and a conveyor to cut a substrate. The control module of the computer calculates a total number of cuts of the substrate and a distance that the substrate moves before each cut of the substrate according to user input. A conveyer control module of the computer controls the conveyer to move the substrate, where a reminder signal is sent out after the substrate has moved the distance. A cutter control module of the computer controls the cutter to cut the substrate.
Public/Granted literature
- US20110230997A1 SYSTEM AND METHOD FOR CUTTING SUBSTRATE INTO WORKPIECES Public/Granted day:2011-09-22
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