Invention Grant
US08554355B2 System and method for cutting substrate into workpieces 有权
将基材切割成工件的系统和方法

System and method for cutting substrate into workpieces
Abstract:
A computer obtains user input from an input to control a cutter and a conveyor to cut a substrate. The control module of the computer calculates a total number of cuts of the substrate and a distance that the substrate moves before each cut of the substrate according to user input. A conveyer control module of the computer controls the conveyer to move the substrate, where a reminder signal is sent out after the substrate has moved the distance. A cutter control module of the computer controls the cutter to cut the substrate.
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