Invention Grant
- Patent Title: Substrate transfer method and substrate transfer apparatus
- Patent Title (中): 基板转印方法和基板转印装置
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Application No.: US13172364Application Date: 2011-06-29
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Publication No.: US08554360B2Publication Date: 2013-10-08
- Inventor: Katsuhiro Morikawa
- Applicant: Katsuhiro Morikawa
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2005-351397 20051206
- Main IPC: G06F7/00
- IPC: G06F7/00

Abstract:
A substrate transfer method of delivering a substrate transferred by a transfer arm to a mounting unit and associated apparatus. The method includes moving the transfer arm to a position above the mounting unit, and, when delivering the substrate onto the mounting unit, detecting a mounting portion of the mounting unit by a mounting portion detector having a light emitting element and a light receiving element provided at opposite positions across a center point of the transfer arm on a bottom surface of the transfer arm, and then lowering the transfer arm in an oblique direction to mount the substrate on the mounting unit.
Public/Granted literature
- US20110257783A1 SUBSTRATE TRANSFER METHOD AND SUBSTRATE TRANSFER APPARATUS Public/Granted day:2011-10-20
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