Invention Grant
- Patent Title: RFID methods in the manufacture of reclosable packages
- Patent Title (中): RFID方法制造可再封闭包装
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Application No.: US11443914Application Date: 2006-05-31
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Publication No.: US08554642B2Publication Date: 2013-10-08
- Inventor: Robert C. Stolmeier , Robert E. Hogan
- Applicant: Robert C. Stolmeier , Robert E. Hogan
- Applicant Address: US IL Glenview
- Assignee: Illinois Tool Works Inc.
- Current Assignee: Illinois Tool Works Inc.
- Current Assignee Address: US IL Glenview
- Agency: McCarter & English, LLP
- Main IPC: G06Q10/00
- IPC: G06Q10/00 ; G08B13/14
Abstract:
The present disclosure relates to the implanting of RFID (radio frequency identification) chips into the slider of a zipper of a reclosable package. This allows for subsequent reading of the RFID identifying data to identify associated with the reclosable package. This can be done by using the RFID data directly or by using the RFID data to access a database This can be done for authentication, security, quality control, inventory control and similar purposes.
Public/Granted literature
- US20070294148A1 RFID methods in the manufacture of reclosable packages Public/Granted day:2007-12-20
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