Invention Grant
- Patent Title: Parallel solving of layout optimization
- Patent Title (中): 并行求解布局优化
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Application No.: US13151413Application Date: 2011-06-02
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Publication No.: US08555229B2Publication Date: 2013-10-08
- Inventor: Xiaoping Tang , Michael S. Gray , Xin Yuan
- Applicant: Xiaoping Tang , Michael S. Gray , Xin Yuan
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Hoffman Warnick LLC
- Agent Richard M. Kotulak
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
Solutions for optimizing an integrated circuit layout for implementation in an integrated circuit are disclosed. In one embodiment, a computer-implemented method is disclosed including: obtaining a plurality of hierarchical constraints in mathematical form, the plurality of hierarchical constraints defining a first integrated circuit layout; partitioning the plurality of hierarchical constraints into groups according to one or more partitioning rules; determining whether a boundary condition exists between two of the groups, and distributing a slack or a gap between the two of the groups in the case that the boundary condition exists; creating a plurality of integer linear programming problems associated with each of the groups; determining a solution for each of the plurality of integer linear programming problems; and integrating each solution together to form a second integrated circuit layout.
Public/Granted literature
- US20120311517A1 PARALLEL SOLVING OF LAYOUT OPTIMIZATION Public/Granted day:2012-12-06
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