Invention Grant
US08555230B2 Isolation method and package using a high isolation differential ball grid array (BGA) pattern 有权
隔离方法和封装采用高隔离差分球栅阵列(BGA)图案

  • Patent Title: Isolation method and package using a high isolation differential ball grid array (BGA) pattern
  • Patent Title (中): 隔离方法和封装采用高隔离差分球栅阵列(BGA)图案
  • Application No.: US12234516
    Application Date: 2008-09-19
  • Publication No.: US08555230B2
    Publication Date: 2013-10-08
  • Inventor: Louis Catuogno
  • Applicant: Louis Catuogno
  • Applicant Address: US IL Chicago
  • Assignee: The Boeing Company
  • Current Assignee: The Boeing Company
  • Current Assignee Address: US IL Chicago
  • Agency: Caven & Aghevli LLC
  • Main IPC: G06F17/50
  • IPC: G06F17/50
Isolation method and package using a high isolation differential ball grid array (BGA) pattern
Abstract:
According to an embodiment an improved Application Specific Integrated Circuit (ASIC) isolation method and system for assigning signal pins in an ASIC package having a plurality of signal pins is disclosed. The method and system comprise identifying an isolation requirement of the ASIC and determining an optimized pattern for substantially diagonal pairing of signal pins in relation to the isolation requirement. The method includes pairing signal pairs substantially diagonally in accordance with the pattern.
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