Invention Grant
- Patent Title: Multilayer rigid flexible printed circuit board and method for manufacturing the same
- Patent Title (中): 多层刚性柔性印刷电路板及其制造方法
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Application No.: US12923994Application Date: 2010-10-19
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Publication No.: US08558116B2Publication Date: 2013-10-15
- Inventor: Yang Je Lee , Dek Gin Yang , Dong Gi An , Jae Ho Shin
- Applicant: Yang Je Lee , Dek Gin Yang , Dong Gi An , Jae Ho Shin
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2009-0102783 20091028
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.
Public/Granted literature
- US20110094776A1 Multilayer rigid flexible printed circuit board and method for manufacturing the same Public/Granted day:2011-04-28
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