Invention Grant
- Patent Title: Removable IC package stiffening brace and method
- Patent Title (中): 可拆卸IC封装加强支架及方法
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Application No.: US12729922Application Date: 2010-03-23
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Publication No.: US08559180B2Publication Date: 2013-10-15
- Inventor: Paul J. Brown , Alex L. Chan
- Applicant: Paul J. Brown , Alex L. Chan
- Applicant Address: FR Paris
- Assignee: Alcatel Lucent
- Current Assignee: Alcatel Lucent
- Current Assignee Address: FR Paris
- Agency: Kramer + Amado, P.C.
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K7/02 ; H05K7/04

Abstract:
Various exemplary embodiments relate to a brace for use with an integrated circuit (IC), and to an IC package with a brace, having a main body portion and a fastening portion for mechanically fastening the main body portion to the IC, by for example clipping or sliding attachment. Other exemplary embodiments relate to a method of stabilizing an IC during an operation carried out on the IC, such as a soldering operation, involving for example steps of attaching a brace to the IC, performing the operation on the IC, and/or removing the brace after performing the operation.
Public/Granted literature
- US20110235283A1 REMOVABLE IC PACKAGE STIFFENING BRACE AND METHOD Public/Granted day:2011-09-29
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