Invention Grant
US08559180B2 Removable IC package stiffening brace and method 有权
可拆卸IC封装加强支架及方法

Removable IC package stiffening brace and method
Abstract:
Various exemplary embodiments relate to a brace for use with an integrated circuit (IC), and to an IC package with a brace, having a main body portion and a fastening portion for mechanically fastening the main body portion to the IC, by for example clipping or sliding attachment. Other exemplary embodiments relate to a method of stabilizing an IC during an operation carried out on the IC, such as a soldering operation, involving for example steps of attaching a brace to the IC, performing the operation on the IC, and/or removing the brace after performing the operation.
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