Invention Grant
- Patent Title: Management of a 3D package and cooling system
- Patent Title (中): 管理3D封装和冷却系统
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Application No.: US12936000Application Date: 2008-04-01
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Publication No.: US08560141B2Publication Date: 2013-10-15
- Inventor: Amip Shah , Chandrakant Patel
- Applicant: Amip Shah , Chandrakant Patel
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- International Application: PCT/US2008/059020 WO 20080401
- International Announcement: WO2009/123622 WO 20091008
- Main IPC: G06F19/00
- IPC: G06F19/00
Abstract:
In a method for managing at least one three-dimensional package and a cooling system having at least one active cooling mechanism configured to cool the at least one three-dimensional package, at least one of workload on and an environmental condition on or around the at least one three-dimensional package is identified. In addition, at least one of an active cooling mechanism and a three-dimensional package is controlled based upon at least one of the identified workload and environmental condition.
Public/Granted literature
- US20110029154A1 Management Of A 3D Package And Cooling System Public/Granted day:2011-02-03
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