Invention Grant
- Patent Title: Methods using block co-polymer self-assembly for sub-lithographic patterning
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Application No.: US13157168Application Date: 2011-06-09
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Publication No.: US08562844B2Publication Date: 2013-10-22
- Inventor: Dan B. Millward
- Applicant: Dan B. Millward
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John, P.S.
- Main IPC: H01L21/302
- IPC: H01L21/302 ; B81C1/00
Abstract:
Block copolymers can be self-assembled and used in methods as described herein for sub-lithographic patterning, for example. The block copolymers can be diblock copolymers, triblock copolymers, multiblock copolymers, or combinations thereof. Such methods can be useful for making devices that include, for example, sub-lithographic conductive lines.
Public/Granted literature
- US20110240596A1 Methods Using Block Co-Polymer Self-Assembly for Sub-Lithographic Patterning Public/Granted day:2011-10-06
Information query
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